FBR expects a 25% peak-to-trough revenue compression during this downcycle, in part because of component distributors de-stocking inventory. But FBR analysts project a fundamental bottom should form in the first half of 2009 and that distributors will replenish component inventories sometime this summer, providing an industry catalyst in the second half.

The analog, high-bandwidth communications, and Ethernet IC vendor now projects Q4 revenues will be down 18% to 20%, compared with the company's previous guidance issued in late October of down 7% to 13%.

Shin-Etsu Polymer Co. Ltd. has developed a jig for handling thin wafers that can endure 260°C in a solder reflow furnace. The tool makes it possible to use a silicone film to attach solder balls to thinned wafers for 3-D stacked chips.

Over the past year, readers turned to stories and webcasts about trends in semiconductor manufacturing and markets, with photovoltaics muscling its way through much of the Top 100. The economy seemed to get worse as the year went along, nosediving in the fall, which accounted for attention paid to economic forecasts. Changes to the ITRS and trends in packaging/3-D interconnects also proved attractive to our readers in 2008.