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Rudolph NSX Selected for Inspection of TSV Process
Rudolph Technologies Inc. said that it has installed an NSX 115 Macro Inspection System at a major European fab. The NSX tool performs 2-D and 3-D metrology and inspection of defects during the same production cycle.

Virage Logic launches bid to acquire LogicVision
After a November expression of interest got the cold shoulder, IP provider Virage Logic today announced that it has sent the board of directors of LogicVision a formal offer to acquire the company's outstanding stock for $1.05 per share, or about $10 million.

Intel, Hitachi agree to develop SSDs for business use
The companies said the products, expected in 2010, will complement traditional rotating-media drives by addressing applications that require particularly fast I/O performance, demand high reliability, and need to reduce power consumption and its attendant heat dissipation.

IEEE Awards Declerck, Lai, Datta and Bruel
The IEEE named IMEC CEO Gilbert Declerck as recipient of the Frederik Philips Award, and flash memory pioneer Stefan Lai will receive the Andrew S. Grove Award. The awards are among a series to be presented at the upcoming IEDM conference.

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News from the Web

TSMC honors suppliers at annual Supply Chain Management Forum
Source: www.fabtech.org
Date: 24 minutes ago
LogicVision Confirms Receipt of Unsolicited Acquisition Proposal
Source: news.prnewswire.com
Date: 2 hours 43 minutes ago
MVTS and Verigy Offer V93000 Port Scale RF Solutions (Business Wire)
Source: biz.yahoo.com
Date: 3 hours 57 minutes ago
Intersil Announces the Resignation of David Zinsner, Chief Financial Officer - Zibb.com
Source: Comtex
Date: 4 hours 21 minutes ago

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Wafer Processing Applied Announces TSV Etcher, In-Fab Mask Inspection Capability SUSS MicroTec Names New CEO TSMC Begins Production of 40 nm Designs View All Stories	Lithography Applied Announces TSV Etcher, In-Fab Mask Inspection Capability SUSS MicroTec Names New CEO FSI Receives Repeat Polaris Order From GaAs Foundry View All Stories
Yield Management TI Blitzes to Improve Fab Productivity ISMI Outlines 450 mm Wafer, NGF Roadmaps Despite Losses, Toshiba to Continue Aggressive Investments View All Stories	Inspection, Measurement & Test Applied Announces TSV Etcher, In-Fab Mask Inspection Capability Memory Test Platform Handles Multiple Device Types Measuring Material, Dopant Loss From Post-Implant Wafer Cleans View All Stories
Clean Processing FSI Enters Single-Wafer Clean Market Measuring Material, Dopant Loss From Post-Implant Wafer Cleans Environmental Regulations Growing More Complex View All Stories	Materials December Sneak Peek: Optimize Wafer Thickness for 450 mm IBM Offers 45 nm SOI Foundry Solution Light on the Road to Low-k Integration View All Stories

News from Lexis Nexis

Suntech Announces Accident at Production Facilities

Samsung, Hynix Mull Investment Plans During Credit Crisis

California Has Big Solar Power Plans

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Perspectives From the Leading Edge
Philip Garrou, Consultant,
November 29, 2008
Highlights of 3D ASIP
Without question the title of the RTI sponsored 3D Integration conference &ld...
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THE MEASURE OF ALL THINGS
Alexander E. Braun, Senior Editor, Semiconductor International
November 14, 2008
Hurray for the Do-Gooders!
We all know that technology has changed our lives, and as the innovators wh...
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VIEWS ON NEWS
David Lammers, News Editor, Semiconductor International
November 14, 2008
Luther Forest, Just in Time
As the Thanksgiving holiday approaches in the United States, people in the U.S. chip ...
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FLOAT ZONE
Laura Peters, Editor-in-Chief, Semiconductor International
September 26, 2008
Halla’s Perfect Storm of Technology Neglect
Back in 2005, I sat in on a great keynote speech by Brian Halla, CEO and President of...
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They have a chance to survive if they can get a wad of cash to get through the time w...
J Boone - 12/3/2008 4:58:15 PM PT
in response to Qimonda Indicates Merger May Be Imminent

YAWN - this is now two days old. Get a proper job....
cheap reporters - 12/3/2008 6:23:55 AM PT
in response to Qimonda Indicates Merger May Be Imminent

Qimonda is highly damaged goods. Whatever the terms and conditions of any merger is, ...
Samsung is scorching the earth - 12/2/2008 7:08:04 PM PT
in response to Qimonda Indicates Merger May Be Imminent

OLD REGURGITATED NEWS. I TOLD YOU EARLIER....
yesterdays_news - 12/2/2008 2:00:23 PM PT
in response to Qimonda Indicates Merger May Be Imminent

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Metrology's Challenges at the Nanoscale Realm
Alain Diebold, CNSE

Professor Describes Unipolar CMOS Proposal
T.P Ma, Yale University

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